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Executive Technical Program Committee

Taeko Ando
Ritsumeikan University
JAPAN

Azadeh Ansari
Georgia Institute of Technology
USA

Nuria Barniol
UAB
SPAIN

Philippe Basset
Univ Gustave Eiffel / ESYCOM lab
FRANCE

Pierre Blondy
XLIM University of Limoges CNRS
FRANCE

Karen Cheung
University of British Columbia
CANADA

Eric Chiou
University of California at Los Angeles
USA

Caroline Coutier
CEA
FRANCE

Jaume Esteve
CSIC
SPAIN

Philip Feng
University of Florida
USA

Eiji Higurashi
National Institute of Advanced Industrial Science and Technology
JAPAN

David Horsley
UC Davis
USA

Beomjoon Kim
The University of Tokyo
JAPAN

Eun Kim
University of Southern California
USA

Haluk Külah
METU
TURKEY

Franz Laermer
Robert Bosch GmbH
GERMANY

Hyunjoo Jenny Lee
KAIST
KOREA

Thierry Leichle
Georgia Tech-CNRS
USA

Wen Li
Michigan State University
USA

Zhihong Li
Peking University
CHINA

Cheng-Yao Lo
National Tsing Hua University
TAIWAN

Michel Maharbiz
UC Berkeley / iota Biosciences, Inc.
USA

Farnaz Niroui
Massachusetts Institute of Technology
USA

Stella W. Pang
City University of Hong Kong
HONG KONG

Jungyul Park
Sogang University
KOREA

Hoang Phuong Phan
Griffith University
AUSTRALIA

Swaminathan Rajaraman
University of Central Florida and Primordia BioSystems
USA

Robert Roberts
The University of Texas at El Paso
USA

Xavier Rottenberg
IMEC
BELGIUM

Niclas Roxhed
KTH Royal Institute of Technology
SWEDEN

Francesca Santoro
Istituto Italiano di Tecnologia
ITALY

Silvan Schmid
TU Wien
AUSTRIA

Fabian Stoppel
Fraunhofer Institute for Silicon Technology ISIT
GERMANY

Takaaki Suzuki
Gunma University
JAPAN

Shuji Tanaka
Tohoku University
JAPAN

Tiger Tao
Shanghai Institute of Microsystem and Information Technology, CAS
CHINA

Guillermo Villanueva
EPFL
SWITZERLAND

Sten Vollebregt
Delft University of Technology
NETHERLANDS

Sandra Vos
NXP
USA

Fei Wang
Southern University of Science and Technology
CHINA

Zenghui Wang
University of Electronic Science and Technology of China
CHINA

Dana Weinstein
Purdue university
USA

Anders Wolff
Technical University of Denmark
DENMARK

Guangyu Xu
University of Massachusetts Amherst
USA

Yao-Joe Yang
National Taiwan University
TAIWAN

Euisik Yoon
University of Michigan
USA

Siyang Zheng
Carnegie Mellon University
USA

Yao Zhu
A*STAR, Institute of Microelectronics
SINGAPORE