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The 35th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2022) is one of the premier annual events reporting research results on all scientific aspects of Micro/Nanoscale Devices, Micro/Nanosystems, as well as their relevant technologies and industrial trends. The conference will be held as a hybrid meeting for the first time in our conference's history. The in-person component -- held at the Tokyo International Forum -- will be paired with a virtual conference site hosted on-line. This conference captures the rapid proliferation from the commitment and success of the multidisciplinary microsystems and nanotechnology research communities. In recent years, the annual IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has established the forum for presenting over 200 select papers in lecture and poster sessions. Its highly integrated format provides ample opportunities for interactions among attendees, presenters and exhibitors. While the current COVID-19 pandemic and global travel restrictions impose unprecedented challenges on having the conference in traditional fashion, the IEEE MEMS 2022 will be the first-ever hybrid conference in this series, and will be the international forum where our multidisciplinary communities showcase our resilience and sustained endeavors, in advancing the field and venturing into new frontiers.

IEEE MEMS 2022 will be held in Tokyo, Japan, 9 - 13 January 2022 (Sunday - Thursday). The major areas of activities in the development of MEMS/NEMS solicited and expected at this conference include but are not limited to:
  • Design, simulation and analysis tools with experimental verification
  • Fabrication technologies and processes
  • Silicon and beyond-silicon materials (e.g., piezoelectric, ferroelectric, wide-bandgap, 2D materials, soft materials, composites, etc.)
  • Electro-mechanical integration techniques
  • Assembly and packaging approaches
  • Metrology and operational evaluation techniques
  • System architectures
The major areas of activities in the applications of MEMS/NEMS solicited and expected at this conference include but are not limited to:
  • Mechanical, thermal, and magnetic sensors and actuators, and micro/nanosystems
  • Opto-mechanical microdevices and microsystems
  • Fluidic microcomponents and microsystems
  • Microdevices for data storage
  • Microdevices for biomedical engineering
  • Micro chemical analysis systems
  • Microdevices and systems for wireless communication
  • Microdevices for power supply and energy harvesting
  • Nano-electro-mechanical devices and systems
  • Scientific micro-instruments and metrology
  • Emerging trends and new opportunities for MEMS/NEMS (e.g., quantum, internet of things, nonlinear dynamics, AI & robotics, etc.