Authors » Abstract Categories
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Materials, Fabrication and Packaging for Generic MEMS & NEMS
1.01 New & Emerging Materials for MEMS/NEMS (e.g., Piezoelectric, Ferroelectric, Wide-Bandgap, 2D Materials, Soft Materials, Heterostructures, Composites, Metamaterials)
1.02 Advancement in Conventional Materials for MEMS & NEMS
1.03 Generic MEMS & NEMS Manufacturing Techniques
1.04 New Fabrication Processes for Making MEMS/NEMS
1.05 Digital Micromanufacturing (Laser Micromachining, Additive Manufacturing)
1.06 Packaging & Assembly
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Micro- & Nanofluidics
2.01 Materials for Micro & Microfluidics
2.02 Manufacturing for Micro- and Nanofluidics
2.03 Generic Microfluidics & Nanofluidics
2.04 Biological and Medical Microfluidics and Nanofluidics
2.05 Integrated/Embedded Microfluidics and Nanofluidic Systems & Platforms
2.06 Modeling of Micro & Nanofluidics
2.07 Other Micro- and Nanofluidics
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Bio & Medical MEMS
3.01 MEMS & BioMEMS for Fighting COVID-19 & Future Pandemic
3.02 MEMS & BioMEMS for Healthcare and Public Health
3.03 Materials for Bio- and Medical MEMS
3.04 Devices & Systems for Cellular and Molecular Studies (e.g., Cancer Cells, Proteomics, Genetics)
3.05 Manufacturing for Bio- & Medical MEMS
3.06 Nanobiotechnology
3.07 Biosensors and Bioreactors
3.08 Tissue Engineering
3.09 Flexible and Wearable Devices and Systems (e.g., Electronic/MEMS Skins and Sensors, etc.)
3.10 Medical Microsystems (Probes, Implantables, Minimally Invasive, etc.)
3.11 Other Bio and Medical MEMS
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MEMS Physical & Chemical Sensors
4.01 Materials for Physical Sensors
4.02 Manufacturing Techniques for Physical Sensors
4.03 Nanoscale Physical Sensors
4.04 Inertial Sensors (Gyros, Accelerometers, Resonators, etc.)
4.05 Fluidic Sensors (Flow, Pressure, Density, Viscosity, etc.)
4.06 Sonic & Ultrasonic MEMS Transducers (Microphones, CMUT, PMUTs, etc.)
4.07 Gas & Chemical Sensors
4.08 Force & Displacement Sensors (Tactile, Force, Torque, Stress & Strain Sensor)
4.09 Metrology and Measurement Techniques for MEMS/NEMS Sensors
4.10 Other Physical Sensors
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MEMS/NEMS for Optical, RF and Electromagnetics
5.01 Materials for Electromagnetic Transducers
5.02 Manufacturing for Electromagnetic Transducers
5.03 DC & Low Frequency Magnetic & Electrochemical Components & Systems
5.04 Electrical Field and Magnetic Field Sensors and Transducers
5.05 RF MEMS Components & Systems (e.g., for 5G Applications)
5.06 MEMS for Timing & Frequency Control
5.07 THz MEMS Components & Systems
5.08 Photonic Components & Systems
5.09 Free Space Optical Components & Systems (Displays, Lenses, Detectors)
5.10 Infrared (IR) Sensors and Imaging Systems
5.11 Other Electromagnetic MEMS/NEMS
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MEMS Actuators & Power MEMS
6.01 Materials for Actuators & Power MEMS
6.02 Manufacturing for Actuators & Power MEMS
6.03 Actuator Components & Systems
6.04 Energy Harvesting Materials, Structures, and Transducers
6.05 Self-Powered Devices and Microsystems
6.06 Power MEMS Components & Systems
6.07 Other Actuators & Power MEMS
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Industry MEMS and Advancing MEMS for Products and Sustainability
7.01 MEMS/NEMS - CMOS Integration
7.02 MEMS/NEMS - Photonics Integration
7.03 New MEMS System Design and Integration Approaches
7.04 MEMS Packaging Techniques
7.05 Methods of Product Comparison
7.06 Measurement Methods for Product Specs
7.07 MEMS vs. Macro: Pros and Cons of Miniaturization in Actual Products
7.08 Barriers to Commercialization & Research Needs for Future Products
7.09 Fabrication Models for Products
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Emerging Technologies & New Opportunities for MEMS/NEMS
8.01 Quantum Devices and Systems with MEMS/NEMS
8.02 Internet of Things (IoT) with MEMS/NEMS
8.03 Nonlinear Dynamics in MEMS/NEMS
8.04 New Computing Devices and Systems with MEMS/NEMS
8.05 Machine Learning (ML) & Artificial Intelligence (AI)-Enhanced MEMS/NEMS Design, Manufacturing, and Applications
8.06 MEMS/NEMS for the Hardware of AI, Virtual Reality, Augmented Reality
8.07 MEMS/NEMS for Hardware Security (e.g., Electronic Circuits, Systems)
8.08 MEMS/NEMS for Advancing Scientific Instrumentation and Metrology