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Reflecting the rapid growth of the MEMS field and the commitment and success of its research community, the IEEE MEMS Conference series has evolved into a premier annual event in the MEMS area. The 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2015) is one of the premier annual events reporting research results on every aspect of Microsystems technology. This Conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors. MEMS 2015 will be held in Estoril, Portugal, from 18 - 22 January, 2015. The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to:
- Design, simulation and analysis tools with experimental verification
- Fabrication technologies and processes
- Silicon and non-silicon materials
- Electro-mechanical integration techniques
- Assembly and packaging approaches
- Metrology and operational evaluation techniques
- System architecture
The major areas of activity in the development of MEMS and NEMS solicited and expected at this conference include but are not limited to materials, design, simulation, fabrication, assembly, packaging, experimental verification and analysis of micro- and nanocomponents. The major areas of activity in the application of MEMS and NEMS solicited and expected at this conference include but are not limited to:
- Microfluidic and Nanofluidic Devices
- Lab-on-Chip and Biochemical Sensors
- Medical Microsystems, for example Probes, Implantables, Minimally Invasive Devices, Etc.
- Physical Sensors, for example Inertial Sensors (Gyros, Accelerometers, Resonators), Fluidic Sensors (Flow, Pressure, Density, Viscosity), Sonic and Ultrasonic MEMS Transducers (Microphones, PMUTs), Gas and Chemical Sensors, Force and Displacement Sensors (Tactile, Force, Torque, Stress and Strain Sensor)
- Electromagnetic transducers, for example electrostatic and magnetic actuators, RF, THz and optic/photonic MEMS Components and Systems
- Microactuators
- Microdevices for power supply and energy harvesting
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