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Executive Technical Program Committee

Cédric Ayela
CNRS
FRANCE

Nuria Barniol
Universitat Autonoma de Barcelona
SPAIN

Sarah Bedair
US Army Research Laboratory
USA

Fernando Benito Lopez
University of the Basque Country
SPAIN

Sunil Bhave
Purdue University
USA

Cristian Cassella
Northeastern University
USA

Lingqian Chang
Beihang University
CHINA

Seokheun "Sean" Choi
State University of New York
USA

Irene Fernandez-Cuesta
University of Hamburg
GERMANY

Frank Goldschmidtboeing
University Freiburg
GERMANY

Siddhartha Ghosh
Northeastern University
USA

Jerwei Hsieh
Asia Pacific Microsystems, Inc.
TAIWAN

Fatimah Ibrahim
UNIVERSITI MALAYA
MALAYSIA

Kentaro Iwami
Tokyo University of Ag. and Tech.
JAPAN

Nathan Jackson
University of New Mexico
USA

Bowen Ji
Northwestern Polytechnical University
CHINA

Michael Kraft
KU Leuven
BELGIUM

Franz Laermer
Robert Bosch GmbH
GERMANY

Hyowon (Hugh) Lee
Purdue University
USA

Hyunjoo Jenny Lee
KAIST
KOREA (ROK)

Sheng-Shian Li
National Tsing Hua University
TAIWAN

Wei-Chang Li
National Taiwan University
TAIWAN

Wen Li
Michigan State University
USA

Peter Lillehoj
Rice University
USA

Jing-Quan Liu
Shanghai Jiao Tong University
CHINA

Andreu Llobera
Silicon Austria Labs
AUSTRIA

Luyao Lu
George Washington University
USA

Ruochen Lu
The University of Texas at Austin
USA

Jianmin Miao
Shanghai Jiaotong University
CHINA

Hiroshi Miyajima
Sumitomo Precision Products Co.,Ltd.
JAPAN

Farnaz Niroui
MIT
USA

Hiroaki Onoe
Keio University
JAPAN

Mina Rais-Zadeh
NASA JPL
USA

Jose Luis Sanchez-Rojas
Universidad Castilla La Mancha
SPAIN

Hamed Sattari
CSEM
SWITZERLAND

Karsten Seidl
Fraunhofer IMS / Univ. Duisburg-Essen
GERMANY

Ashwin Seshia
University of Cambridge
UK

Massood Tabib-Azar
U of Utah
USA

Roozbeh Tabrizian
University of Florida
USA

Takashiro Tsukamoto
Tohoku University
JAPAN

Luis Velasquez-Garcia
Massachusetts Institute of Technology
USA

Jaume Verd
University of the Balearic Islands
SPAIN

Dana Weinstein
Purdue University
USA

Guoqiang Wu
Wuhan University
CHINA

Shinya Yoshida
Shibaura Institute of Technology
JAPAN

John Zhang
Dartmouth College
USA

Chun Zhao
University of York
UK

Rong Zhu
Tsinghua University
CHINA