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About » Program Committee
Executive Technical Program Committee
Cédric Ayela
CNRS
FRANCE
Nuria Barniol
Universitat Autonoma de Barcelona
SPAIN
Sarah Bedair
US Army Research Laboratory
USA
Fernando Benito Lopez
University of the Basque Country
SPAIN
Sunil Bhave
Purdue University
USA
Cristian Cassella
Northeastern University
USA
Lingqian Chang
Beihang University
CHINA
Seokheun "Sean" Choi
State University of New York
USA
Irene Fernandez-Cuesta
University of Hamburg
GERMANY
Frank Goldschmidtboeing
University Freiburg
GERMANY
Siddhartha Ghosh
Northeastern University
USA
Jerwei Hsieh
Asia Pacific Microsystems, Inc.
TAIWAN
Fatimah Ibrahim
UNIVERSITI MALAYA
MALAYSIA
Kentaro Iwami
Tokyo University of Ag. and Tech.
JAPAN
Nathan Jackson
University of New Mexico
USA
Bowen Ji
Northwestern Polytechnical University
CHINA
Michael Kraft
KU Leuven
BELGIUM
Franz Laermer
Robert Bosch GmbH
GERMANY
Hyowon (Hugh) Lee
Purdue University
USA
Hyunjoo Jenny Lee
KAIST
KOREA (ROK)
Sheng-Shian Li
National Tsing Hua University
TAIWAN
Wei-Chang Li
National Taiwan University
TAIWAN
Wen Li
Michigan State University
USA
Peter Lillehoj
Rice University
USA
Jing-Quan Liu
Shanghai Jiao Tong University
CHINA
Andreu Llobera
Silicon Austria Labs
AUSTRIA
Luyao Lu
George Washington University
USA
Ruochen Lu
The University of Texas at Austin
USA
Jianmin Miao
Shanghai Jiaotong University
CHINA
Hiroshi Miyajima
Sumitomo Precision Products Co.,Ltd.
JAPAN
Farnaz Niroui
MIT
USA
Hiroaki Onoe
Keio University
JAPAN
Mina Rais-Zadeh
NASA JPL
USA
Jose Luis Sanchez-Rojas
Universidad Castilla La Mancha
SPAIN
Hamed Sattari
CSEM
SWITZERLAND
Karsten Seidl
Fraunhofer IMS / Univ. Duisburg-Essen
GERMANY
Ashwin Seshia
University of Cambridge
UK
Massood Tabib-Azar
U of Utah
USA
Roozbeh Tabrizian
University of Florida
USA
Takashiro Tsukamoto
Tohoku University
JAPAN
Luis Velasquez-Garcia
Massachusetts Institute of Technology
USA
Jaume Verd
University of the Balearic Islands
SPAIN
Dana Weinstein
Purdue University
USA
Guoqiang Wu
Wuhan University
CHINA
Shinya Yoshida
Shibaura Institute of Technology
JAPAN
John Zhang
Dartmouth College
USA
Chun Zhao
University of York
UK
Rong Zhu
Tsinghua University
CHINA