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Lam Research Corporation
4650 Cushing Parkway
Fremont, CA 94538 USA
Phone: 1-510-572-1999
Fax: 1-510-572-4924
Website: www.lamrc.com

Booth 7

Building on the award-winning 2300 Exelan® Series, the 2300 Exelan Flex™ incorporates Dual Frequency Confined™ technology and the Waferless Auto Clean™ process. Additional technology addresses future production challenges via improve 193 nm photoresist compatibility, uniformity and CD control, and process windows. Lam's 2300 Versys® Kiyo™ provides key manufacturing capabilities required for 65 nm and beyond: excellent within wafer, wafer to wafer, and chamber to chamber uniformity and defect control for 300 mm. Based on Lam's production proven TCP® 9400PTX, the TCP® 9400 DSiE™ for deep RIE silicon etch solutions offers wide process capability and flexibility for varying types of MEMS-based applications.