Invitation Letter - Current Support - Past Support - Exhibit Hall Floorplan - Exhibition Schedule - Contracts

EV Group
DI Erich Thallner Strasse 1
St. Florian/Inn, Schärding, 4782 AUSTRIA
Phone: 43-7712-5311-0
Fax: 43-7712-5311-4600
Website: www.evgroup.com

Booth 34

EV Group provides leading-edge wafer processing equipment for MEMS and Microfluidics, Advanced Packaging, Compound Semiconductor/MOEMS, SOI, Power Devices and Nanotechnology applications: Double side mask/bond aligners. Wafer bonders for anodic, silicon fusion, thermo compression and LowTemp plasma bonding. Wafer/mask cleaning systems. Temporary bonders and debonders. Resist processing systems, photoresist spin/spray coaters and developers. Hot embossing and nanoimprinting systems. Optical test and inspection systems. EV Group holds the dominant share of the market for wafer bonding equipment (especially SOI bonding) and is a leader in lithography for advanced packaging, MEMS and nanotechnology.